SPC5200CVR400 vs UPD30500BS2-300 feature comparison

SPC5200CVR400 NXP Semiconductors

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UPD30500BS2-300 NEC Electronics Group

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEC ELECTRONICS CORP
Package Description TEBGA-272 LBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Additional Feature AEC QUALIFIED; BUT NOT GIVEN STANDARD ALSO REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 13 64
Boundary Scan YES NO
External Data Bus Width 32 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e1 e0
Length 27 mm 29 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.65 mm 1.7 mm
Speed 400 MHz 300 MHz
Supply Voltage-Max 1.58 V 1.9 V
Supply Voltage-Min 1.42 V 1.7 V
Supply Voltage-Nom 1.5 V 1.8 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Part Package Code BGA
Pin Count 272
Bit Size 64
Clock Frequency-Max 100 MHz
Qualification Status Not Qualified

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