SPC5607BF1MLU6
vs
SPC5607BF1MLU6
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
|
Pin Count |
176
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Bit Size |
32
|
32
|
JESD-30 Code |
S-PQFP-G176
|
S-PQFP-G176
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
176
|
176
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
LFQFP
|
Package Equivalence Code |
QFP176,1.0SQ,20
|
QFP176,1.0SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
98304
|
98304
|
ROM (words) |
1572864
|
1572864
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Speed |
64 MHz
|
64 MHz
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Base Number Matches |
2
|
1
|
Factory Lead Time |
|
4 Weeks
|
Has ADC |
|
YES
|
Address Bus Width |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
16 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
YES
|
External Data Bus Width |
|
64
|
Length |
|
24 mm
|
Number of I/O Lines |
|
149
|
On Chip Program ROM Width |
|
8
|
PWM Channels |
|
YES
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Supply Voltage-Nom |
|
5 V
|
Width |
|
24 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
|
|
|