SPC5607BF1MLU6
vs
SPC5607BF1MLU6
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
,
|
|
| Pin Count |
176
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
16 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
64
|
| JESD-30 Code |
|
S-PQFP-G176
|
| JESD-609 Code |
|
e3
|
| Length |
|
24 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of I/O Lines |
|
149
|
| Number of Terminals |
|
176
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFQFP
|
| Package Equivalence Code |
|
QFP176,1.0SQ,20
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
98304
|
| ROM (words) |
|
1572864
|
| ROM Programmability |
|
FLASH
|
| Screening Level |
|
AEC-Q100
|
| Speed |
|
64 MHz
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
24 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
|
|
|