SPC5777CLK3MMO3 vs SPC5777CCK3MME3R feature comparison

SPC5777CLK3MMO3 NXP Semiconductors

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SPC5777CCK3MME3R NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description MAPBGA-516 MAPBGA-416
Reach Compliance Code compliant compliant
ECCN Code 5A992.C 5A992.C
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 16 Weeks 16 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Additional Feature ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE. ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
Address Bus Width
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PBGA-B516 S-PBGA-B416
JESD-609 Code e2 e2
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Terminals 516 416
On Chip Program ROM Width 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
RAM (bytes) 524288 524288
ROM (words) 8388608 8388608
ROM Programmability FLASH FLASH
Seated Height-Max 2.02 mm 2.02 mm
Speed 264 MHz 264 MHz
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Date Of Intro 2016-03-08

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Compare SPC5777CCK3MME3R with alternatives