SPD5817VSMSS vs MLL5817 feature comparison

SPD5817VSMSS Solid State Devices Inc (SSDI)

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MLL5817 Microsemi Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer SOLID STATE DEVICES INC MICROSEMI CORP
Package Description HERMETIC SEALED, SMS, 2 PIN
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Application GENERAL PURPOSE GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.55 V 0.45 V
JESD-30 Code O-LELF-R2 O-LELF-R2
Non-rep Pk Forward Current-Max 25 A 50 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 150 °C
Output Current-Max 1 A 1 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Reference Standard MIL MIL-19500/586
Rep Pk Reverse Voltage-Max 20 V 20 V
Surface Mount YES YES
Technology SCHOTTKY SCHOTTKY
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Base Number Matches 1 1
Rohs Code No
Additional Feature FREE WHEELING DIODE
JEDEC-95 Code DO-213AB
JESD-609 Code e0
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD

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