SRM2B256SLMX70
vs
K6X0808C1D-GF700
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
S-MOS SYSTEMS
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
,
|
SOP, SOP28,.45
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
120 ns
|
70 ns
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| I/O Type |
|
COMMON
|
| Length |
|
18.29 mm
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP28,.45
|
| Seated Height-Max |
|
3 mm
|
| Standby Current-Max |
|
0.00001 A
|
| Standby Voltage-Min |
|
2 V
|
| Supply Current-Max |
|
0.025 mA
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
8.38 mm
|
|
|
|
Compare SRM2B256SLMX70 with alternatives
Compare K6X0808C1D-GF700 with alternatives