SRM2B256SLMX70 vs UPD43256BGU-70L feature comparison

SRM2B256SLMX70 Epson Electronics America Inc

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UPD43256BGU-70L NEC Electronics Group

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer S-MOS SYSTEMS NEC ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description , 0.450 INCH, PLASTIC, SOP-28
Pin Count 28 28
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 120 ns 70 ns
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -25 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Length 18 mm
Package Code SOP
Seated Height-Max 2.95 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 8.4 mm

Compare SRM2B256SLMX70 with alternatives

Compare UPD43256BGU-70L with alternatives