SST34HF1622S-70-4C-L1PE
vs
SST34HF1641J-70-4E-L1PE
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SILICON STORAGE TECHNOLOGY INC
|
GREENLIANT SYSTEMS LTD
|
| Part Package Code |
BGA
|
|
| Package Description |
LFBGA,
|
,
|
| Pin Count |
56
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Additional Feature |
SRAM IS ORGANIZED AS 128K X 16 / 256K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8
|
|
| JESD-30 Code |
R-PBGA-B56
|
|
| JESD-609 Code |
e1
|
|
| Length |
10 mm
|
|
| Memory Density |
16777216 bit
|
|
| Memory IC Type |
MEMORY CIRCUIT
|
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
56
|
|
| Number of Words |
1048576 words
|
|
| Number of Words Code |
1000000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
1MX16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.4 mm
|
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
8 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare SST34HF1622S-70-4C-L1PE with alternatives