STM32F103RBH7XXX
vs
STM32F103RBH7
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA, BGA64,8X8,20
|
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
32
|
| CPU Family |
CORTEX-M3
|
CORTEX-M3
|
| Clock Frequency-Max |
72 MHz
|
16 MHz
|
| DAC Channels |
YES
|
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
32
|
|
| JESD-30 Code |
S-PBGA-B64
|
S-PBGA-B64
|
| Length |
5 mm
|
5 mm
|
| Number of I/O Lines |
51
|
51
|
| Number of Terminals |
64
|
64
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
FBGA
|
| Package Equivalence Code |
BGA64,8X8,20
|
BGA64,8X8,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
20480
|
20480
|
| ROM (words) |
131072
|
131072
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.2 mm
|
|
| Speed |
1.25 MHz
|
72 MHz
|
| Supply Current-Max |
50.3 mA
|
50.3 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
2 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
5 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
10 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
|
|
Compare STM32F103RBH7XXX with alternatives
Compare STM32F103RBH7 with alternatives