STM32F105V8H7 vs STM32F105V8H6XXX feature comparison

STM32F105V8H7 STMicroelectronics

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STM32F105V8H6XXX STMicroelectronics

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Part Life Cycle Code Active Active
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer STMicroelectronics
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 25 MHz 25 MHz
DMA Channels YES YES
External Data Bus Width
Length 10 mm 10 mm
Number of I/O Lines 80 80
Number of Terminals 100 100
PWM Channels YES YES
Package Code BGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Speed 72 MHz 72 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Package Description LFBGA, BGA100,10X10,32
Pin Count 100
CPU Family CORTEX-M3
DAC Channels YES
JESD-30 Code S-XBGA-B100
Number of DMA Channels 12
Number of Timers 10
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Equivalence Code BGA100,10X10,32
Qualification Status Not Qualified
RAM (bytes) 20480
ROM (words) 65536
ROM Programmability FLASH
Seated Height-Max 1.7 mm
Supply Current-Max 69 mA
Technology CMOS
Temperature Grade INDUSTRIAL

Compare STM32F105V8H7 with alternatives

Compare STM32F105V8H6XXX with alternatives