STM32L152V8H6TTR vs STM32L152V8H6TR feature comparison

STM32L152V8H6TTR STMicroelectronics

Buy Now Datasheet

STM32L152V8H6TR STMicroelectronics

Buy Now Datasheet
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 24 MHz 32 MHz
DMA Channels YES YES
External Data Bus Width
Length 7 mm 7 mm
Number of I/O Lines 83 83
Number of Terminals 100 100
PWM Channels YES YES
Package Code VFBGA VFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Speed 32 MHz 32 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Rohs Code Yes
Part Package Code BGA
Package Description 7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, UFBGA-100
Pin Count 100
ECCN Code 3A991.A.2
Factory Lead Time 12 Weeks
Samacsys Manufacturer STMicroelectronics
CPU Family CORTEX-M3
DAC Channels YES
JESD-30 Code S-PBGA-B100
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA100,12X12,20
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
RAM (bytes) 10240
ROM (words) 65536
ROM Programmability FLASH
Seated Height-Max 0.6 mm
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare STM32L152V8H6TTR with alternatives

Compare STM32L152V8H6TR with alternatives