STM8AF6146TDXXXU
vs
DSPIC33FJ32GP203T-H/PT
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
,
|
10 X 10 MM, 2 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44
|
Pin Count |
32
|
44
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G44
|
Number of Terminals |
32
|
44
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
ECCN Code |
|
3A991.A.2
|
Address Bus Width |
|
|
Bit Size |
|
16
|
Clock Frequency-Max |
|
40 MHz
|
External Data Bus Width |
|
|
JESD-609 Code |
|
e3
|
Length |
|
10 mm
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
140 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Code |
|
TQFP
|
Peak Reflow Temperature (Cel) |
|
260
|
ROM Programmability |
|
FLASH
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max |
|
3.6 V
|
Supply Voltage-Min |
|
3 V
|
Supply Voltage-Nom |
|
3.3 V
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
Matte Tin (Sn)
|
Terminal Pitch |
|
0.8 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
10 mm
|
|
|
|
Compare STM8AF6146TDXXXU with alternatives
Compare DSPIC33FJ32GP203T-H/PT with alternatives