STM8AF6146TDXXXU
vs
MC9S08QA2CDNE
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFP
|
SOIC
|
| Package Description |
,
|
SOP,
|
| Pin Count |
32
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| JESD-30 Code |
S-PQFP-G32
|
R-PDSO-G8
|
| Number of Terminals |
32
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-609 Code |
|
e3
|
| Length |
|
4.9 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of I/O Lines |
|
6
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Code |
|
SOP
|
| Peak Reflow Temperature (Cel) |
|
260
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.75 mm
|
| Speed |
|
20 MHz
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
1.8 V
|
| Supply Voltage-Nom |
|
3 V
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
3.9 mm
|
|
|
|
Compare STM8AF6146TDXXXU with alternatives
Compare MC9S08QA2CDNE with alternatives