STM8L052C6T6
vs
STM32L152CBU6TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
QFP
|
QFN
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
32
|
| CPU Family |
STM8
|
CORTEX-M3
|
| Clock Frequency-Max |
16 MHz
|
32 MHz
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G48
|
S-XQCC-N48
|
| Length |
7 mm
|
7 mm
|
| Number of I/O Lines |
41
|
37
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
QFP
|
HVQCCN
|
| Package Equivalence Code |
QFP48,.35SQ,20
|
LCC48,.27SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
2048
|
16384
|
| ROM (words) |
32768
|
131072
|
| ROM Programmability |
FLASH
|
FLASH
|
| Speed |
16 MHz
|
32 MHz
|
| Supply Current-Max |
4.75 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
HVQCCN, LCC48,.27SQ,20
|
| Manufacturer Package Code |
|
UFQFPN
|
| DAC Channels |
|
YES
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| On Chip Program ROM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
0.6 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare STM8L052C6T6 with alternatives
Compare STM32L152CBU6TR with alternatives