SY10H646LJCTR
vs
MC100H646FNG
feature comparison
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ONSEMI
|
Package Description |
LCC-28
|
LEAD FREE, PLASTIC, LCC-28
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
10H
|
100H
|
Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
Length |
11.48 mm
|
11.505 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
28
|
28
|
Number of True Outputs |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Packing Method |
TR
|
|
Propagation Delay (tpd) |
3.3 ns
|
6.4 ns
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.48 mm
|
11.505 mm
|
fmax-Min |
160 MHz
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QLCC
|
Pin Count |
|
28
|
Manufacturer Package Code |
|
776-02
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e3
|
Max I(ol) |
|
0.024 A
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
LDCC28,.5SQ
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
7 ns
|
Qualification Status |
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
|
0.5 ns
|
Terminal Finish |
|
TIN
|
|
|
|
Compare SY10H646LJCTR with alternatives
Compare MC100H646FNG with alternatives