SY58603UMGTR
vs
SY89875UMITR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DFN
|
DFN
|
Package Description |
HVSON,
|
HVQCCN,
|
Pin Count |
8
|
16
|
Manufacturer Package Code |
MLF
|
MLF
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A991.B.1
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
CAN ALSO OPERATE WITH 3.3V SUPPLY
|
|
Family |
58603
|
89875
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL MUX
|
JESD-30 Code |
S-PDSO-N8
|
S-XQCC-N16
|
JESD-609 Code |
e4
|
e0
|
Length |
2 mm
|
3 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
8
|
16
|
Number of True Outputs |
2
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVSON
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
0.35 ns
|
0.87 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.9 mm
|
0.95 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
2 mm
|
3 mm
|
fmax-Min |
2500 MHz
|
|
Base Number Matches |
2
|
1
|
Date Of Intro |
|
2018-04-19
|
Same Edge Skew-Max (tskwd) |
|
0.015 ns
|
|
|
|
Compare SY58603UMGTR with alternatives
Compare SY89875UMITR with alternatives