SY89295UTGTR
vs
SY100EP196VTCTR
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICREL INC
|
MICREL INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
TQFP,
|
TQFP,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE
|
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V
|
| Family |
CMOS
|
100E
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e4
|
e0
|
| Length |
7 mm
|
7 mm
|
| Logic IC Type |
ACTIVE DELAY LINE
|
ACTIVE DELAY LINE
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
1023
|
1023
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
TQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, THIN PROFILE
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Programmable Delay Line |
YES
|
YES
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
2
|
2
|
| Technology |
|
ECL
|
| Total Delay-Nom (td) |
|
12.2 ns
|
|
|
|
Compare SY89295UTGTR with alternatives
Compare SY100EP196VTCTR with alternatives