SY89874AUMG
vs
CY2DP1504ZXC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ROCHESTER ELECTRONICS INC
|
| Package Description |
QFN-16
|
TSSOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Family |
89874
|
2DL
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-XQCC-N16
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
6.5 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
16
|
20
|
| Number of True Outputs |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Packing Method |
TUBE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.7 ns
|
0.48 ns
|
| Same Edge Skew-Max (tskwd) |
0.015 ns
|
0.03 ns
|
| Seated Height-Max |
0.9 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
4.4 mm
|
| fmax-Min |
2500 MHz
|
1500 MHz
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
20
|
| Qualification Status |
|
COMMERCIAL
|
|
|
|
Compare SY89874AUMG with alternatives
Compare CY2DP1504ZXC with alternatives