SYS82000RKXC-12
vs
5962-9461101HYX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOSAIC SEMICONDUCTOR INC
|
WHITE MICROELECTRONICS
|
| Part Package Code |
SIP
|
|
| Package Description |
,
|
CERAMIC, QFP-68
|
| Pin Count |
38
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
120 ns
|
120 ns
|
| JESD-30 Code |
R-PSMA-T38
|
S-CQFP-F68
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
8
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
38
|
68
|
| Number of Words |
2097152 words
|
524288 words
|
| Number of Words Code |
2000000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
2MX8
|
512KX32
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Position |
SINGLE
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Length |
|
39.625 mm
|
| Package Code |
|
QFF
|
| Screening Level |
|
MIL-PRF-38534 Class H
|
| Seated Height-Max |
|
3.56 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
39.625 mm
|
|
|
|
Compare SYS82000RKXC-12 with alternatives
Compare 5962-9461101HYX with alternatives