SZN6328CSMS
vs
TZM5245B-GS18
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Package Description |
O-LELF-R2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
|
| Terminal Form |
WRAP AROUND
|
|
| Terminal Position |
END
|
|
| Voltage Tol-Max |
2%
|
5%
|
| Working Test Current |
8.5 mA
|
8.5 mA
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| Dynamic Impedance-Max |
|
16 Ω
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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