TA31143FN-TP1 vs CMX823P3 feature comparison

TA31143FN-TP1 Toshiba America Electronic Components

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CMX823P3 CML Microcircuits Plc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP CML MICROCIRCUITS LTD
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G16 R-PDIP-T16
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.9 mA 3 mA
Surface Mount YES NO
Telecom IC Type PAGING RECEIVER PAGING DECODER
Temperature Grade OTHER INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Length 19.685 mm
Seated Height-Max 5.08 mm
Supply Voltage-Nom 5 V
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare TA31143FN-TP1 with alternatives

Compare CMX823P3 with alternatives