TC4023BP vs MC14023BCP feature comparison

TC4023BP Toshiba America Electronic Components

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MC14023BCP Motorola Semiconductor Products

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP MOTOROLA INC
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-14 PLASTIC, DIP-14
Pin Count 14
Reach Compliance Code unknown compliant
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Length 19.25 mm 18.86 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 4.69 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 5
HTS Code 8542.39.00.01
Max I(ol) 0.004200000000000001 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 300 ns
Schmitt Trigger NO

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