TC4052BP vs 74HCT4053DB,118 feature comparison

TC4052BP Toshiba America Electronic Components

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74HCT4053DB,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Package Description DIP, DIP16,.3 5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Analog IC - Other Type DIFFERENTIAL MULTIPLEXER SPDT
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.25 mm 6.2 mm
Number of Channels 8 1
Number of Functions 1 3
Number of Terminals 16 16
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 10 Ω 9 Ω
On-state Resistance-Max (Ron) 1200 Ω 180 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP16,.3 SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 2 mm
Supply Current-Max (Isup) 0.6 mA 0.32 mA
Supply Voltage-Max (Vsup) 18 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Switch-off Time-Max 450 ns 44 ns
Switch-on Time-Max 380 ns 48 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code SOT338-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Moisture Sensitivity Level 1
Signal Current-Max 0.025 A
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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Compare 74HCT4053DB,118 with alternatives