TC54VC1402EMB713
vs
TC54VC1402EZBTR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELCOM SEMICONDUCTOR INC
|
| Part Package Code |
SOT-89
|
|
| Package Description |
LEAD FREE, PLASTIC, SOT-89, 3 PIN
|
TO-92, 3 PIN
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
20 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
VOLTAGE DETECTOR
|
VOLTAGE DETECTOR
|
| JESD-30 Code |
R-PSSO-F3
|
O-PBCY-W3
|
| JESD-609 Code |
e3
|
|
| Length |
4.495 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSOF
|
|
| Package Equivalence Code |
TO-243
|
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Current-Max (Isup) |
0.004 mA
|
|
| Supply Voltage-Max (Vsup) |
10 V
|
10 V
|
| Supply Voltage-Min (Vsup) |
0.7 V
|
0.7 V
|
| Supply Voltage-Nom (Vsup) |
2 V
|
2.1 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
FLAT
|
WIRE
|
| Terminal Pitch |
1.5 mm
|
|
| Terminal Position |
SINGLE
|
BOTTOM
|
| Threshold Voltage-Nom |
+1.4V
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
2.445 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
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