TC551001AFL-70 vs K6X1008C2D-BQ700 feature comparison

TC551001AFL-70 Toshiba America Electronic Components

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K6X1008C2D-BQ700 Samsung Semiconductor

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP32,.56
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0
Length 20.6 mm 20.47 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 3 mm
Standby Voltage-Min 2 V 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.7 mm 11.43 mm
Base Number Matches 5 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code SOP32,.56
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.000025 A
Supply Current-Max 0.025 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare TC551001AFL-70 with alternatives

Compare K6X1008C2D-BQ700 with alternatives