TC55V040XB-70 vs IS62US25616LL-70B feature comparison

TC55V040XB-70 Toshiba America Electronic Components

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IS62US25616LL-70B Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description VFBGA, MINI, BGA-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 12 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V 2.2 V
Supply Voltage-Min (Vsup) 2.7 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

Compare TC55V040XB-70 with alternatives

Compare IS62US25616LL-70B with alternatives