TC55V16176FF-133 vs CY7C1386FV25-250BGI feature comparison

TC55V16176FF-133 Toshiba America Electronic Components

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CY7C1386FV25-250BGI Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code QFP BGA
Package Description LQFP, QFP100,.63X.87 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
Pin Count 100 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.2 ns 2.6 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e0 e0
Length 20 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 1048576 words 524288 words
Number of Words Code 1000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX18 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 2.4 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.38 mA
Supply Voltage-Max (Vsup) 3.465 V 2.625 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1

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