TC622VPA vs TC622EOA feature comparison

TC622VPA Telcom Semiconductor Inc

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TC622EOA Telcom Semiconductor Inc

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer TELCOM SEMICONDUCTOR INC TELCOM SEMICONDUCTOR INC
Package Description PLASTIC, DIP-8 SOIC-8
Reach Compliance Code unknown unknown
Accuracy-Max (Cel) 5 Cel 5 Cel
Body Breadth 6.35 mm 3.9 mm
Body Height 4.32 mm 1.37 mm
Body Length or Diameter 9.5 mm 4.9 mm
Housing PLASTIC PLASTIC
JESD-609 Code e0 e0
Mounting Feature THROUGH HOLE MOUNT SURFACE MOUNT
Number of Terminals 8 8
Operating Current-Max 0.6 mA 0.6 mA
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape/Style RECTANGULAR RECTANGULAR
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SINGLE TRIP POINT TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SINGLE TRIP POINT
Supply Voltage-Max 18 V 18 V
Supply Voltage-Min 4.5 V 4.5 V
Surface Mount NO YES
Temperature Coefficient POSITIVE ppm/°C POSITIVE ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Termination Type SOLDER SOLDER
Base Number Matches 2 2