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TC74HC00AFN vs 74HC00D-Q100 feature comparison

TC74HC00AFN Toshiba America Electronic Components

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74HC00D-Q100 Nexperia

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code End Of Life Active
Ihs Manufacturer TOSHIBA CORP NEXPERIA
Part Package Code SOIC
Package Description 0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-14 SOP-14
Pin Count 14
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 1 2
Family HC/UH
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm
Logic IC Type NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 135 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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