TC74HC00AP
vs
8403701CA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
MOTOROLA INC
Part Package Code
DIP
Package Description
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
S-CQCC-N20
Length
19.25 mm
8.89 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT APPLICABLE
Prop. Delay@Nom-Sup
19 ns
Propagation Delay (tpd)
95 ns
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
4.45 mm
2.03 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT APPLICABLE
Width
7.62 mm
8.89 mm
Base Number Matches
1
5
Compare TC74HC00AP with alternatives
Compare 8403701CA with alternatives