TC74HC00AP vs MC74HC00AND feature comparison

TC74HC00AP Toshiba Electronic Devices & Storage Corporation

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MC74HC00AND Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Package Description Dip, Dip14,.3 Dip, Dip14,.3
Reach Compliance Code Unknown Unknown
HTS Code 8542.39.00.01
Family Hc/Uh
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.25 Mm
Load Capacitance (CL) 50 Pf
Logic IC Type Nand Gate Nand Gate
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material Plastic/Epoxy Plastic/Epoxy
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape Rectangular Rectangular
Package Style In-Line In-Line
Peak Reflow Temperature (Cel) Not Specified
Prop. Delay@Nom-Sup 19 Ns 19 Ns
Propagation Delay (tpd) 95 Ns
Qualification Status Not Qualified
Schmitt Trigger No No
Seated Height-Max 4.45 Mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount No No
Technology Cmos Cmos
Temperature Grade Industrial Industrial
Terminal Form Through-Hole Through-Hole
Terminal Pitch 2.54 Mm 2.54 Mm
Terminal Position Dual Dual
Time@Peak Reflow Temperature-Max (s) Not Specified
Width 7.62 Mm
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Power Supplies 2/6 V
Terminal Finish Tin/Lead (Sn/Pb)