TC74HC00AP
vs
MM54HC00J
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Package Description |
Dip, Dip14,.3
|
Dip, Dip14,.3
|
| Reach Compliance Code |
Unknown
|
Unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
Hc/Uh
|
Hc/Uh
|
| JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
| Length |
19.25 Mm
|
19.43 Mm
|
| Load Capacitance (CL) |
50 Pf
|
50 Pf
|
| Logic IC Type |
Nand Gate
|
Nand Gate
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
Plastic/Epoxy
|
Ceramic, Glass-Sealed
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
In-Line
|
In-Line
|
| Peak Reflow Temperature (Cel) |
Not Specified
|
|
| Prop. Delay@Nom-Sup |
19 Ns
|
27 Ns
|
| Propagation Delay (tpd) |
95 Ns
|
27 Ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
No
|
No
|
| Seated Height-Max |
4.45 Mm
|
5.08 Mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
No
|
No
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Military
|
| Terminal Form |
Through-Hole
|
Through-Hole
|
| Terminal Pitch |
2.54 Mm
|
2.54 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
Not Specified
|
|
| Width |
7.62 Mm
|
7.62 Mm
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin Lead
|
|
|
|