TC74HC00AP vs SN74HC00J4 feature comparison

TC74HC00AP Toshiba Electronic Devices & Storage Corporation

Buy Now Datasheet

SN74HC00J4 Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Package Description Dip, Dip14,.3 Dip, Dip14,.3
Reach Compliance Code Unknown Unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family Hc/Uh Hc
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Length 19.25 Mm 19.56 Mm
Load Capacitance (CL) 50 Pf 50 Pf
Logic IC Type Nand Gate Nand Gate
Max I(ol) 0.004 A 0.0052 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material Plastic/Epoxy Ceramic, Glass-Sealed
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape Rectangular Rectangular
Package Style In-Line In-Line
Peak Reflow Temperature (Cel) Not Specified
Prop. Delay@Nom-Sup 19 Ns 23 Ns
Propagation Delay (tpd) 95 Ns 115 Ns
Qualification Status Not Qualified
Schmitt Trigger No No
Seated Height-Max 4.45 Mm 5.08 Mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount No No
Technology Cmos Cmos
Temperature Grade Industrial Industrial
Terminal Form Through-Hole Through-Hole
Terminal Pitch 2.54 Mm 2.54 Mm
Terminal Position Dual Dual
Time@Peak Reflow Temperature-Max (s) Not Specified
Width 7.62 Mm 7.62 Mm
Base Number Matches 2 2
Rohs Code No
Power Supply Current-Max (ICC) 0.02 Ma