TC74HC00APF vs 74HC00D feature comparison

TC74HC00APF Toshiba America Electronic Components

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74HC00D Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Part Package Code DIP
Package Description Dip, Dip14,.3 Sop, Sop14,.25
Pin Count 14
Reach Compliance Code Compliant Unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family Hc/Uh
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 Mm
Load Capacitance (CL) 50 Pf 50 Pf
Logic IC Type Nand Gate Nand Gate
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material Plastic/Epoxy Plastic/Epoxy
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape Rectangular Rectangular
Package Style In-Line Small Outline
Packing Method Tube Tube
Peak Reflow Temperature (Cel) Not Specified 260
Prop. Delay@Nom-Sup 19 Ns 27 Ns
Propagation Delay (tpd) 95 Ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger No No
Seated Height-Max 4.45 Mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount No Yes
Technology Cmos Cmos
Temperature Grade Industrial Automotive
Terminal Form Through-Hole Gull Wing
Terminal Pitch 2.54 Mm 1.27 Mm
Terminal Position Dual Dual
Time@Peak Reflow Temperature-Max (s) Not Specified
Width 7.62 Mm
Base Number Matches 1 4
JESD-609 Code e4
Moisture Sensitivity Level 1
Terminal Finish Nickel Palladium Gold