TC74HC132AP(F) vs CD54HC00F3A feature comparison

TC74HC132AP(F) Toshiba America Electronic Components

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CD54HC00F3A Harris Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Part Package Code DIP
Package Description Dip, Dip14,.3 Dip, Dip14,.3
Pin Count 14
Reach Compliance Code Compliant Unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family Hc/Uh Hc/Uh
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Length 19.25 Mm
Logic IC Type Nand Gate Nand Gate
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material Plastic/Epoxy Ceramic, Glass-Sealed
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape Rectangular Rectangular
Package Style In-Line In-Line
Peak Reflow Temperature (Cel) Not Specified
Propagation Delay (tpd) 140 Ns
Seated Height-Max 4.45 Mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount No No
Technology Cmos Cmos
Temperature Grade Industrial Military
Terminal Form Through-Hole Through-Hole
Terminal Pitch 2.54 Mm 2.54 Mm
Terminal Position Dual Dual
Time@Peak Reflow Temperature-Max (s) Not Specified
Width 7.62 Mm
Base Number Matches 1 3
JESD-609 Code e0
Max I(ol) 0.00002 A
Prop. Delay@Nom-Sup 27 Ns
Qualification Status Not Qualified
Schmitt Trigger No
Screening Level 38535q/M;38534h;883b
Terminal Finish Tin/Lead (Sn/Pb)