TC74HC132AP(F) vs MC74HCT00ADR2 feature comparison

TC74HC132AP(F) Toshiba America Electronic Components

Buy Now Datasheet

MC74HCT00ADR2 Motorola Mobility LLC

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Part Package Code DIP SOIC
Package Description Dip, Dip14,.3 Sop, Sop14,.25
Pin Count 14 14
Reach Compliance Code Compliant Unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family Hc/Uh Hct
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 Mm 8.65 Mm
Logic IC Type Nand Gate Nand Gate
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material Plastic/Epoxy Plastic/Epoxy
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape Rectangular Rectangular
Package Style In-Line Small Outline
Peak Reflow Temperature (Cel) Not Specified
Propagation Delay (tpd) 140 Ns 28 Ns
Seated Height-Max 4.45 Mm 1.75 Mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount No Yes
Technology Cmos Cmos
Temperature Grade Industrial Military
Terminal Form Through-Hole Gull Wing
Terminal Pitch 2.54 Mm 1.27 Mm
Terminal Position Dual Dual
Time@Peak Reflow Temperature-Max (s) Not Specified
Width 7.62 Mm 3.9 Mm
Base Number Matches 1 3
Pbfree Code No
JESD-609 Code e0
Load Capacitance (CL) 50 Pf
Packing Method Tr
Qualification Status Not Qualified
Schmitt Trigger No
Terminal Finish Tin Lead