TC74HC132AP vs 74HC132N,652 feature comparison

TC74HC132AP Toshiba America Electronic Components

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74HC132N,652 NXP Semiconductors

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Source Content uid TC74HC132AP 74HC132N,652
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 SOT-27-1, DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba NXP
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.25 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 28 ns 31 ns
Propagation Delay (tpd) 140 ns 38 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 4.45 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Manufacturer Package Code SOT27-1
JESD-609 Code e4
Packing Method BULK
Terminal Finish NICKEL PALLADIUM GOLD

Compare TC74HC132AP with alternatives

Compare 74HC132N,652 with alternatives