TC74HC280AP
vs
HD74HC280P-E
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Transferred
|
| Ihs Manufacturer |
TOSHIBA CORP
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP14,.3
|
DIP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
1989-03-21
|
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
| Length |
19.25 mm
|
19.2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
PARITY GENERATOR/CHECKER
|
PARITY GENERATOR/CHECKER
|
| Number of Bits |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
250 ns
|
255 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.45 mm
|
5.06 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Supply Voltage-Nom (Vsup) |
|
4.5 V
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare TC74HC280AP with alternatives
Compare HD74HC280P-E with alternatives