TC74HC4066AF-TP1EL vs 935190990112 feature comparison

TC74HC4066AF-TP1EL Toshiba America Electronic Components

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935190990112 NXP Semiconductors

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 14 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDSO-G14 R-PDIP-T16
JESD-609 Code e0 e4
Length 10.3 mm 19.025 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels 1 8
Number of Functions 4 1
Number of Terminals 14 16
Off-state Isolation-Nom 60 dB 50 dB
On-state Resistance Match-Nom 5 Ω 2 Ω
On-state Resistance-Max (Ron) 80 Ω 145 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 4.2 mm
Supply Current-Max (Isup) 0.08 mA
Supply Voltage-Nom (Vsup) 12 V 6 V
Surface Mount YES NO
Switch-off Time-Max 24 ns 36 ns
Switch-on Time-Max 12 ns 41 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare TC74HC4066AF-TP1EL with alternatives

Compare 935190990112 with alternatives