TC74HC4066AF-TP2EL
vs
935190990112
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
DIP,
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T16
|
| Length |
10.3 mm
|
19.025 mm
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Channels |
1
|
8
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
14
|
16
|
| Off-state Isolation-Nom |
60 dB
|
50 dB
|
| On-state Resistance Match-Nom |
5 Ω
|
2 Ω
|
| On-state Resistance-Max (Ron) |
80 Ω
|
145 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
4.2 mm
|
| Supply Current-Max (Isup) |
0.08 mA
|
|
| Supply Voltage-Nom (Vsup) |
12 V
|
6 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
24 ns
|
36 ns
|
| Switch-on Time-Max |
12 ns
|
41 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e4
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare TC74HC4066AF-TP2EL with alternatives
Compare 935190990112 with alternatives