TC74HCT373AP vs SN74HCT373PWLE feature comparison

TC74HCT373AP Toshiba America Electronic Components

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SN74HCT373PWLE Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code DIP TSSOP
Package Description DIP, DIP20,.3 TSSOP, TSSOP20,.25
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDSO-G20
Length 24.6 mm 6.5 mm
Load Capacitance (CL) 150 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP20,.3 TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 38 ns 44 ns
Propagation Delay (tpd) 48 ns 65 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 4.4 mm
Base Number Matches 1 1
Pbfree Code No
Samacsys Manufacturer Texas Instruments
Packing Method TR

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