TC74LCX240FWELP
vs
SN74LVC2G240YZPR
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
SOP,
|
GREEN, DSBGA-8
|
| Pin Count |
20
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G20
|
R-XBGA-B8
|
| Length |
12.8 mm
|
1.9 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
4
|
1
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Propagation Delay (tpd) |
6.5 ns
|
11.3 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.7 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.5 mm
|
0.9 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare TC74LCX240FWELP with alternatives
Compare SN74LVC2G240YZPR with alternatives