TC74LVQ138FNELP vs HD74LVC139RP feature comparison

TC74LVQ138FNELP Toshiba America Electronic Components

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HD74LVC139RP Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS TECHNOLOGY CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
Additional Feature 3 ENABLE INPUTS
Family LVQ LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm
Load Capacitance (CL) 50 pF
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 15 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.39.00.01
Input Conditioning STANDARD
Logic IC Type 2-LINE TO 4-LINE DECODER

Compare TC74LVQ138FNELP with alternatives

Compare HD74LVC139RP with alternatives