TC7LX1102WBG
vs
74AVC4T245D-Q100J
feature comparison
Part Life Cycle Code |
End Of Life
|
Active
|
Ihs Manufacturer |
TOSHIBA CORP
|
NEXPERIA
|
Part Package Code |
BGA
|
SOP
|
Package Description |
VFBGA,
|
3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
|
Pin Count |
8
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Family |
LX
|
AVC
|
JESD-30 Code |
R-PBGA-B8
|
R-PDSO-G16
|
Length |
1.6 mm
|
9.9 mm
|
Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
Number of Bits |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
8
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Propagation Delay (tpd) |
17.1 ns
|
10.4 ns
|
Seated Height-Max |
0.64 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
0.8 mm
|
3.9 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
SOT109-1
|
Samacsys Manufacturer |
|
Nexperia
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Packing Method |
|
TR, 13 INCH
|
Peak Reflow Temperature (Cel) |
|
260
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD SILVER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TC7LX1102WBG with alternatives
Compare 74AVC4T245D-Q100J with alternatives