TC7SH17F
vs
NL17SG34DTT1G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
ON SEMICONDUCTOR
|
| Part Package Code |
SSOP
|
|
| Package Description |
LSSOP, TSOP5/6,.11,37
|
TSSOP, TSOP5/6,.11,37
|
| Pin Count |
5
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
LV/LV-A/LVX/H
|
17SG
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| Length |
2.9 mm
|
3 mm
|
| Load Capacitance (CL) |
50 pF
|
30 pF
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Max I(ol) |
0.004 A
|
0.008 A
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
18.5 ns
|
4.8 ns
|
| Propagation Delay (tpd) |
18.5 ns
|
22.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
NO
|
| Seated Height-Max |
1.4 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
0.9 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
1.6 mm
|
1.5 mm
|
| Base Number Matches |
1
|
1
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
20 mA
|
|
|
|
Compare TC7SH17F with alternatives
Compare NL17SG34DTT1G with alternatives