TCLL914BR13
vs
D1FS4
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
|
SHINDENGEN ELECTRIC MANUFACTURING CO LTD
|
| Part Package Code |
MELF
|
|
| Package Description |
HERMETIC SEALED, GLASS, LL-34, MINIMELF-2
|
1F, SMD, 2 PIN
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.80
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Output Current-Max |
0.15 A
|
0.85 A
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Power Dissipation-Max |
0.5 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Recovery Time-Max |
0.004 µs
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
TIN
|
| Terminal Form |
WRAP AROUND
|
C BEND
|
| Terminal Position |
END
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Forward Voltage-Max (VF) |
|
0.55 V
|
| Moisture Sensitivity Level |
|
2
|
| Non-rep Pk Forward Current-Max |
|
30 A
|
| Rep Pk Reverse Voltage-Max |
|
40 V
|
| Technology |
|
SCHOTTKY
|
|
|
|
Compare TCLL914BR13 with alternatives
Compare D1FS4 with alternatives