TCN75-5.0MUAG
vs
LM75BIMM-5
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
TSSOP8,.19
|
PLASTIC, MO-187, MSOP-8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Accuracy-Max (Cel) |
3 Cel
|
3 Cel
|
| Body Breadth |
3 mm
|
3 mm
|
| Body Height |
1 mm
|
0.86 mm
|
| Body Length or Diameter |
3 mm
|
3 mm
|
| Housing |
PLASTIC
|
PLASTIC
|
| JESD-609 Code |
e3
|
e0
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Bits |
9
|
9
|
| Number of Terminals |
8
|
8
|
| Operating Current-Max |
0.25 mA
|
0.28 mA
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
| Package Shape/Style |
SQUARE
|
SQUARE
|
| Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Coefficient |
POSITIVE ppm/°C
|
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn85Pb15)
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare TCN75-5.0MUAG with alternatives
Compare LM75BIMM-5 with alternatives