TD62003AP
vs
MC1413BD
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
ON SEMICONDUCTOR
|
| Part Package Code |
DIP
|
SOIC 16 LEAD
|
| Package Description |
IN-LINE, R-PDIP-T16
|
SMALL OUTLINE, R-PDSO-G16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
Toshiba
|
onsemi
|
| Additional Feature |
LOGIC LEVEL COMPATIBLE
|
LOGIC LEVEL COMPATIBLE
|
| Collector Current-Max (IC) |
500 A
|
0.5 A
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
COMPLEX
|
COMPLEX
|
| DC Current Gain-Min (hFE) |
1000
|
1000
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
7
|
7
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| VCEsat-Max |
1.6 V
|
|
| Base Number Matches |
4
|
4
|
| Manufacturer Package Code |
|
751B-05
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
235
|
|
|
|
Compare TD62003AP with alternatives
Compare MC1413BD with alternatives