TDA2822
vs
TPA3139D2RGER
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FORWARD INTERNATIONAL ELECTRONICS LTD
|
TEXAS INSTRUMENTS INC
|
| Package Description |
,
|
HVQCCN,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2019-10-21
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Bandwidth-Nom |
|
20 kHz
|
| Consumer IC Type |
|
CLASS D AUDIO AMPLIFIER
|
| Gain |
|
26 dB
|
| JESD-30 Code |
|
S-PQCC-N24
|
| JESD-609 Code |
|
e4
|
| Length |
|
4 mm
|
| Moisture Sensitivity Level |
|
1
|
| Noise Figure-Nom |
|
102 dB
|
| Number of Channels |
|
2
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
24
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-10 °C
|
| Output Power-Nom |
|
10 W
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1 mm
|
| Supply Voltage-Max (Vsup) |
|
14.4 V
|
| Supply Voltage-Min (Vsup) |
|
3.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
4 mm
|
|
|
|
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