TDA3653BU
vs
TDA4866
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SFM
SIP
Package Description
POWER, PLASTIC, SOT-110-1, SIP-9
POWER, PLASTIC, SOT-131-2, SIP-9
Pin Count
9
9
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Blanking Output
NO
YES
Consumer IC Type
VERTICAL DEFLECTION IC
VERTICAL DEFLECTION IC
JESD-30 Code
R-PSFM-T9
R-PSIP-T9
JESD-609 Code
e3
e3
Number of Functions
1
1
Number of Terminals
9
9
Operating Temperature-Max
150 °C
75 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SFM
SIP
Package Equivalence Code
SIP9,.1TB
SIP9,.1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
60 V
25 V
Supply Voltage-Min (Vsup)
10 V
8.2 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
OTHER
COMMERCIAL EXTENDED
Terminal Finish
TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
2
Length
23.8 mm
Seated Height-Max
14.2 mm
Width
4.5 mm
Compare TDA3653BU with alternatives
Compare TDA4866 with alternatives