TDA3653BU vs TDA4866 feature comparison

TDA3653BU NXP Semiconductors

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TDA4866 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SFM SIP
Package Description POWER, PLASTIC, SOT-110-1, SIP-9 POWER, PLASTIC, SOT-131-2, SIP-9
Pin Count 9 9
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Blanking Output NO YES
Consumer IC Type VERTICAL DEFLECTION IC VERTICAL DEFLECTION IC
JESD-30 Code R-PSFM-T9 R-PSIP-T9
JESD-609 Code e3 e3
Number of Functions 1 1
Number of Terminals 9 9
Operating Temperature-Max 150 °C 75 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SFM SIP
Package Equivalence Code SIP9,.1TB SIP9,.1
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 60 V 25 V
Supply Voltage-Min (Vsup) 10 V 8.2 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER COMMERCIAL EXTENDED
Terminal Finish TIN Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position SINGLE SINGLE
Base Number Matches 1 2
Length 23.8 mm
Seated Height-Max 14.2 mm
Width 4.5 mm

Compare TDA3653BU with alternatives

Compare TDA4866 with alternatives